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Power Integrations demonstrates 2200V GaN technology ⋆ Electronics Weekly

Another evolution in PowiGaN technology has been announced by Power Integrations. The company has announced that the proprietary semiconductor technology is now rated at up to 2200V. The previous highest. . .

By @ElectronicsNews · · 2 min read

Power Integrations demonstrates 2200V GaN technology ⋆ Electronics Weekly

Another evolution in PowiGaN technology has been announced by Power Integrations. The company has announced that the proprietary semiconductor technology is now rated at up to 2200V. The previous highest rating for PowiGaN ICs was 1700V. PowiGaN techology replace mosfets on the primary side of PowiGaN integrated offline flyback switcher ICs. This results in reduced switching losses and more efficient, smaller and lighter chargers, adapters and open frame power supplies than silicon switches can provide, says the company. Until now, GaN power switches have not been able to meet the higher voltages and power densities of applications such as datacentres, EVs, renewables and HVDC infrastructures. “The shift to 800Vdc bus architectures in AI datacentres is reshaping power semiconductors,” explains Roy Dagher, PhD, technology and market analyst, Compound Semiconductors at Yole Group. “GaN’s voltage ceiling has kept it out of the main power path, ceding that ground to SiC. A 2200V rating changes this, giving margin for single-stage topologies and future-proofing emerging 1500V datacentre and EV designs. We expect the power GaN device market to reach $3. 5bn by 2031. ”PowiGaN ICs rated at 1700V were announced in November 2024 and are being designed into single-stage datacentre auxiliary power applications. The company also offers 1250V PowiGaN for stacked arrays used in the main power path in 800Vdc datacentres. The company says introducing 2200V PowiGaN technology means that even higher bus architectures can be supported, future-proofing power designs for datacentres, EVs, photovoltaic inverters and battery-energy storage systems. Power Integrations‘ vice president, product development, Roland Saint-Pierre, confirmed that the company is starting product development in 2027 for general availability at the end of 2028. Power Integrations extend TOPSwitch IC range with PowiGaN techInfineon forecast surges on AI datacentre PMIC demandAdd us as preferred sourceCaroline HayesCaroline Hayes is the editor of Electronics Weekly. She has been covering the electronics industry for over 30 years, edited UK and pan-European titles and contributed to UK and international online and print publications. Although specialising in the semiconductor market, she also has a keen interest in education, careers and start-up opportunities in the broader electronics industry.

Source: electronicsweekly.com

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